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TFA9843J 2-channel audio ampli?er (se: 1 w to 20 w or btl: 4 w to 40 w) rev. 02 19 january 2004 preliminary data 1. general description the TFA9843J contains two identical audio power ampli?ers. the TFA9843J can be used as two single-ended (se) channels with a ?xed gain of 26 db or one bridge-tied load (btl) channel with a ?xed gain of 32 db. the TFA9843J comes in a 9-pin dil-bent-sil (dbs7p) power package. the TFA9843J is pin compatible with the tfa9842j and tfa9841j. the TFA9843J contains a unique protection circuit that is solely based on multiple temperature measurements inside the chip. this gives maximum output power for all supply voltages and load conditions with no unnecessary audio holes. almost any supply voltage and load impedance combination can be made as long as thermal boundary conditions (number of channels used, external heatsink and ambient temperature) allow it. 2. features n se: 1 w to 20 w; btl: 4 w to 40 w operation possibility n soft clipping n standby and mute mode n no on/off switching plops n low standby current n high supply voltage ripple rejection n outputs short-circuit protected to ground, supply and across the load n thermally protected n pin compatible with the tfa9842j and tfa9841j. 3. applications n television n pc speakers n boom box n mini and micro audio receivers.
philips semiconductors TFA9843J 2-channel audio ampli?er (2 x se or 1 x btl) preliminary data rev. 02 19 january 2004 2 of 21 9397 750 12587 ? koninklijke philips electronics n.v. 2004. all rights reserved. 4. quick reference data 5. ordering information table 1: quick reference data symbol parameter conditions min typ max unit v cc supply voltage operating 9 18 26 v no signal - - 28 v i q quiescent supply current v cc =18v; r l = - 60 100 ma i stb standby supply current - - 10 m a p o se output power thd = 10 %; r l =4 w ; v cc =18v 7 8.5 - w thd = 10 %; r l =4 w ; v cc =22v - 14 - w btl output power thd = 10 %; r l =8 w ; v cc =18v 16 18 - w thd = 10 %; r l =8 w ; v cc =22v - 29 - w thd total harmonic distortion se; p o = 1 w - 0.1 0.5 % btl; p o = 1 w - 0.05 0.5 % g v voltage gain se 25 26 27 db btl 31 32 33 db svrr supply voltage ripple rejection se; f = 1 khz - 60 - db btl; f = 1 khz - 65 - db table 2: ordering information type number package name description version TFA9843J dbs9p plastic dil-bent-sil power package; 9 leads (lead length 12/11 mm); exposed die pad sot523 -1
philips semiconductors TFA9843J 2-channel audio ampli?er (2 x se or 1 x btl) preliminary data rev. 02 19 january 2004 3 of 21 9397 750 12587 ? koninklijke philips electronics n.v. 2004. all rights reserved. 6. block diagram 7. pinning information 7.1 pinning fig 1. block diagram. mdb023 60 k w 60 k w standby mute on short-circuit and temperature protection v ref 0.5v cc v cc v cc 9 4 in1 + in2 + out1 + out2 - svr civ mode 1 3 7 8 2 6 5 gnd TFA9843J fig 2. pin con?guration. TFA9843J mdb024 in2 + out2 - civ in1 + gnd svr mode out1 + v cc 2 1 3 4 5 6 7 8 9
philips semiconductors TFA9843J 2-channel audio ampli?er (2 x se or 1 x btl) preliminary data rev. 02 19 january 2004 4 of 21 9397 750 12587 ? koninklijke philips electronics n.v. 2004. all rights reserved. 7.2 pin description 8. functional description 8.1 input con?guration the input cut-off frequency is: (1) single-ended application: r i =60k w and c i = 220 nf: (2) bridge-tied load application: r i =30k w and c i = 470 nf: (3) as shown in equation 2 and equation 3 , large capacitor values for the inputs are not necessary; so the switch-on delay during charging of the input capacitors can be minimized. this results in a good low frequency response and good switch-on behavior. 8.2 power ampli?er the power ampli?er is a bridge-tied load (btl) or single-ended (se) ampli?er with an all-npn output stage, capable of delivering a peak output current of 4 a. using the TFA9843J as a btl ampli?er offers the following advantages: ? lower peak value of the supply current ? ripple frequency on the supply voltage is twice the signal frequency table 3: pin description symbol pin description in2+ 1 input 2 out2 - 2 inverted loudspeaker terminal 2 civ 3 common input voltage decoupling in1+ 4 input 1 gnd 5 ground svr 6 half supply voltage decoupling (ripple rejection) mode 7 mode selection input (standby, mute and operating) out1+ 8 non inverted loudspeaker terminal 1 v cc 9 supply voltage f i cut off C () 1 2 p r i c i () ---------------------------- - = f i cut off C () 1 2 p 60 10 3 220 10 9 C () ---------------------------------------------------------------- - 12 hz == f i cut off C () 1 2 p 30 10 3 470 10 9 C () ---------------------------------------------------------------- - 11 hz ==
philips semiconductors TFA9843J 2-channel audio ampli?er (2 x se or 1 x btl) preliminary data rev. 02 19 january 2004 5 of 21 9397 750 12587 ? koninklijke philips electronics n.v. 2004. all rights reserved. ? no expensive dc-blocking capacitor ? good low frequency performance. 8.2.1 output power measurement the output power as a function of the supply voltage is measured on the output pins at thd = 10 %; see figure 11 . the maximum output power is limited by the supply voltage of 26 v and the maximum available output current is 4 a repetitive peak current. a minimum load (se) of 3 w is required for supply voltages > 22 v; see figure 5 . a minimum load (btl) of 6 w is required for supply voltages > 22 v; see figure 6 . 8.2.2 headroom typical cd music requires at least 12 db (factor 15.85) dynamic headroom, compared to the average power output, for transferring the loudest parts without distortion. at v cc = 18 v and p o = 5 w (se with r l =4 w ) or p o = 10 w (btl with r l =8 w ) at thd = 0.2 % (see figure 7 ), the average listening level (all) music power without any distortion yields: (4) (5) the power dissipation can be derived from figure 13 (se) or figure 14 (btl) for 0 db respectively 12 db headroom (see ta b l e 4 ). for the average listening level a power dissipation of 4.2 w can be used for a heatsink calculation. 8.3 mode selection the TFA9843J has three functional modes, which can be selected by applying the proper dc voltage to pin mode (see ta b l e 5 and figure 3 ). table 4: power rating as function of headroom headroom power output (thd = 0.2 %) power dissipation (p d ); both channels driven se btl 0db p o =5w p o =10w 8.4w 12 db p o(all) = 315 mw p o(all) = 630 mw 4.2 w p oallse , () 510 3 15.85 ----------------- 315 mw == p o all btl , () 10 10 3 15.85 -------------------- 630 mw == table 5: mode selection v mode ampli?ers 1 and 2 0 to 0.8 v standby 4.5 v to (v cc - 3.5 v) mute (v cc - 2.0 v) to v cc on
philips semiconductors TFA9843J 2-channel audio ampli?er (2 x se or 1 x btl) preliminary data rev. 02 19 january 2004 6 of 21 9397 750 12587 ? koninklijke philips electronics n.v. 2004. all rights reserved. standby in this mode the current consumption is very low and the outputs are ?oating. the device is in standby mode when v mode < 0.8 v, or when pin mode is grounded. mute in this mode the ampli?er is dc-biased but not operational (no audio output). this allows the input coupling capacitors to be charged to avoid pop-noise. the device is in mute mode when 4. 5v(v cc - 2.0 v). 8.4 supply voltage ripple rejection the supply voltage ripple rejection (svrr) is measured with an electrolytic capacitor of 150 m f on pin svr using a bandwidth of 20 hz to 22 khz. figure 17 illustrates the svrr as function of the frequency. a larger capacitor value on pin svr improves the ripple rejection behavior at the lower frequencies. 8.5 built-in protection circuits the TFA9843J contains two types of temperature sensors; one measures local temperatures of the power stages and one measures the global chip temperature. at a local temperature of the power stage of approximately 185 o c or a global temperature of approximately 150 o c this detection circuit switches off the power stages for 2 ms. high impedance of the outputs is the result. after this time period the power stages switch on automatically and the detection will take place again; still a too high temperature switches off the power stages immediately. this protects the TFA9843J against shorts to ground, to the supply voltage, across the load and too high chip temperatures. the protection will only be activated when necessary, so even during a short-circuit condition, a certain amount of (pulsed) current will still be ?owing through the short, just as much as the power stage can handle without exceeding the critical temperature level. fig 3. mode selection. mce502 standby all mute 1/2 on 0.8 4.5 v cc - 3.5 v cc v mode (v) v cc - 2.0
philips semiconductors TFA9843J 2-channel audio ampli?er (2 x se or 1 x btl) preliminary data rev. 02 19 january 2004 7 of 21 9397 750 12587 ? koninklijke philips electronics n.v. 2004. all rights reserved. 9. limiting values 10. thermal characteristics 11. static characteristics [1] a minimum load (btl) of 6 w is allowed at supply voltages > 22 v. [2] with a load connected at the outputs the quiescent supply current will increase. [3] the dc output voltage with respect to ground is approximately 0.5v cc . [4] d v out = ? v out1+ - v out2 - ? table 6: limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v cc supply voltage operating - 0.3 +26 v no signal - 0.3 +28 v v i input voltage - 0.3 v cc + 0.3 v i orm repetitive peak output current - 4 a t stg storage temperature non-operating - 55 +150 c t amb ambient temperature operating - 40 +85 c p tot total power dissipation - 35 w v cc(sc) supply voltage to guarantee short-circuit protection -24v table 7: thermal characteristics symbol parameter conditions value unit r th(j-a) thermal resistance from junction to ambient in free air 40 k/w r th(j-c) thermal resistance from junction to case both channels driven 2.0 k/w table 8: static characteristics v cc =18v; t amb =25 c; r l =8 w ; v mode =v cc ; v i = 0 v; measured in test circuit figure 20 ; unless otherwise speci?ed. symbol parameter conditions min typ max unit v cc supply voltage operating [1] 91826v i q quiescent supply current r l = [2] - 60 100 ma i stb standby supply current v mode =0 - - 10 m a v o dc output voltage [3] -9-v d v out differential output voltage offset btl mode [4] - - 190 mv v mode mode selection input voltage on mode v cc - 2.0 - v cc v mute mode 4.5 - v cc - 3.5 v standby mode 0 - 0.8 v i mode input current on pin mode 0 < v mode <(v cc - 3.5) - - 20 m a
philips semiconductors TFA9843J 2-channel audio ampli?er (2 x se or 1 x btl) preliminary data rev. 02 19 january 2004 8 of 21 9397 750 12587 ? koninklijke philips electronics n.v. 2004. all rights reserved. 12. dynamic characteristics [1] the noise output voltage is measured at the output in a frequency range from 20 hz to 22 khz (unweighted), with a source impedan ce r source =0 w at the input. [2] supply voltage ripple rejection is measured at the output, with a source impedance r source =0 w at the input and with a frequency range from 20 hz to 22 khz (unweighted). the ripple voltage is a sine wave with a frequency f ripple and an amplitude of 300 mv (rms), which is applied to the positive supply rail. [3] output voltage in mute mode (v mode = 7 v) and an input voltage of 1 v (rms) in a bandwidth from 20 hz to 22 khz, so including noise. [1] the noise output voltage is measured at the output in a frequency range from 20 hz to 22 khz (unweighted), with a source impedan ce r source =0 w at the input. [2] supply voltage ripple rejection is measured at the output, with a source impedance r source =0 w at the input and with a frequency range from 20 hz to 22 khz (unweighted). the ripple voltage is a sine wave with a frequency f ripple and an amplitude of 300 mv (rms), which is applied to the positive supply rail. table 9: dynamic characteristics se v cc =18v; t amb =25 c; r l =4 w ; f = 1 khz; v mode =v cc ; measured in test circuit figure 19 ; unless otherwise speci?ed. symbol parameter conditions min typ max unit p o output power thd = 10 %; r l =4 w 7 8.5 - w thd = 0.5 % r l =4 w - 6.5 - w v cc =22v; thd = 10 %; r l =4 w -14-w thd total harmonic distortion p o = 1 w - 0.1 0.5 % g v se voltage gain 25 26 27 db z i input impedance 40 60 - k w v n(o) noise output voltage [1] - 150 - m v svrr supply voltage ripple rejection f ripple = 1 khz [2] -60-db f ripple = 100 hz to 20 khz [2] -60-db v o(mute) output voltage in mute mode [3] - - 150 m v a cs channel separation r source =0 w 50 60 - db | gv | channel unbalance - - 1 db table 10: dynamic characteristics btl v cc =18v; t amb =25 c; r l =8 w ; f = 1 khz; v mode =v cc ; measured in test circuit figure 20 ; unless otherwise speci?ed. symbol parameter conditions min typ max unit p o output power thd = 10 %; r l =8 w 16 18 - w thd = 0.5 %; r l =8 w -14 w v cc =22v; thd = 10 %; r l =8 w -29-w thd total harmonic distortion p o = 1 w - 0.05 0.5 % g v btl voltage gain 31 32 33 db z i input impedance 20 30 - k w v n(o) noise output voltage [1] - 200 - m v svrr supply voltage ripple rejection f ripple = 1 khz [2] -65-db f ripple = 100 hz to 20 khz [2] -65-db v o(mute) output voltage in mute mode [3] - - 250 m v a cs channel separation r source =0 w 50 65 - db | gv | channel unbalance - - 1 db
philips semiconductors TFA9843J 2-channel audio ampli?er (2 x se or 1 x btl) preliminary data rev. 02 19 january 2004 9 of 21 9397 750 12587 ? koninklijke philips electronics n.v. 2004. all rights reserved. [3] output voltage in mute mode (v mode = 7 v) and an input voltage of 1 v (rms) in a bandwidth from 20 hz to 22 khz, so including noise. v i = 50 mv; btl; v cc =18v. fig 4. ac output voltage as function of mode voltage. 20 v mode (v) 04812 v o ( m v) 16 10 7 10 6 10 5 10 4 10 3 10 2 10 1 mce486 thd=10%. thd=10%. fig 5. output power (one channel) as function of supply voltage for various se loads. fig 6. output power (one channel) as function of supply voltage for various btl loads. 8 40 60 20 0 12 28 v cc (v) 16 20 p o (w) 24 mce485 r l = 1 w 8 w 4 w 3 w 2 w 8 60 40 20 0 12 28 v cc (v) 16 20 p o (w) 24 mce484 r l = 2 w 16 w 8 w 6 w 4 w
philips semiconductors TFA9843J 2-channel audio ampli?er (2 x se or 1 x btl) preliminary data rev. 02 19 january 2004 10 of 21 9397 750 12587 ? koninklijke philips electronics n.v. 2004. all rights reserved. v cc = 18 v; se; f = 1 khz; r l =4 w .v cc = 18 v; btl; f = 1 khz; r l =8 w . fig 7. total harmonic distortion as function of output power. fig 8. total harmonic distortion as function of output power. 10 2 10 1 10 - 1 10 - 2 mce488 10 - 1 10 2 110 p o (w) thd + n (%) 10 2 10 1 10 - 1 10 - 2 mce487 10 - 1 1 thd + n (%) 10 p o (w) 10 2 v cc = 18 v; se; p o = 1 w; r l =4 w .v cc = 18 v; btl; p o = 1 w; r l =8 w . fig 9. total harmonic distortion as function of frequency. fig 10. total harmonic distortion as function of frequency. 10 1 10 - 1 10 - 2 mce489 10 thd + n (%) f (hz) 10 2 10 3 10 4 10 5 10 1 10 - 1 10 - 2 mce490 10 thd + n (%) f (hz) 10 2 10 3 10 4 10 5
philips semiconductors TFA9843J 2-channel audio ampli?er (2 x se or 1 x btl) preliminary data rev. 02 19 january 2004 11 of 21 9397 750 12587 ? koninklijke philips electronics n.v. 2004. all rights reserved. thd = 10 %; se; r l =4 w ; f = 1 khz. thd = 10 %; btl; r l =8 w ; f = 1 khz. fig 11. output power as function of supply voltage. fig 12. output power as function of supply voltage. 828 50 0 10 20 30 40 12 p o (w) 16 20 24 v cc (v) mce491 828 50 0 10 20 30 40 12 p o (w) 16 20 24 v cc (v) mce492 v cc = 18 v; se; r l =4 w .v cc = 18 v; btl; r l =8 w . fig 13. total (worst case, both channels driven) power dissipation as function of channel output power per channel. fig 14. total (worst case, both channels driven) power dissipation as function of channel output power per channel. 020 p o (w) 10 0 2 4 6 8 4 p d (w) 81216 mce507 020 p o (w) 10 0 2 4 6 8 4 p d (w) 81216 mce508
philips semiconductors TFA9843J 2-channel audio ampli?er (2 x se or 1 x btl) preliminary data rev. 02 19 january 2004 12 of 21 9397 750 12587 ? koninklijke philips electronics n.v. 2004. all rights reserved. v cc = 18 v; se; r l =4 w .v cc = 18 v; btl; r l =8 w . fig 15. channel separation as function of frequency (no bandpass ?lter applied). fig 16. channel separation as function of frequency (no bandpass ?lter applied). - 100 0 - 80 - 60 - 40 - 20 mce495 10 a cs (db) f (hz) 10 2 10 3 10 4 10 5 - 100 0 - 80 - 60 - 40 - 20 mce496 10 a cs (db) f (hz) 10 2 10 3 10 4 10 5 v cc =18v;se;r source =0 w ;v ripple = 300 mv (rms); a bandpass ?lter of 20 hz to 22 khz has been applied; inputs short-circuited. v cc = 18 v; btl; r source =0 w ;v ripple = 300 mv (rms); a bandpass ?lter of 20 hz to 22 khz has been applied; inputs short-circuited. fig 17. supply voltage ripple rejection as function of frequency. fig 18. supply voltage ripple rejection as function of frequency. - 80 - 60 - 40 - 20 0 mce497 10 svrr (db) f (hz) 10 2 10 3 10 4 10 5 - 80 - 60 - 40 - 20 0 mce498 10 svrr (db) f (hz) 10 2 10 3 10 4 10 5
philips semiconductors TFA9843J 2-channel audio ampli?er (2 x se or 1 x btl) preliminary data rev. 02 19 january 2004 13 of 21 9397 750 12587 ? koninklijke philips electronics n.v. 2004. all rights reserved. 13. application information 13.1 application diagrams remark: switching inductive loads, the output voltage can rise beyond the maximum supply voltage of 28 v. at high supply voltage it is recommended to use (schottky) diodes to the supply voltage and ground. fig 19. se application diagram. micro- controller mce503 60 k w 60 k w 22 m f 220 nf 150 m f standby mute on short-circuit and temperature protection v ref 0.5v cc v cc v cc 9 4 in1 + in2 + out1 + out2 - svr civ mode 1 3 7 8 2 6 5 gnd TFA9843J v i 220 nf v i v cc 1000 m f 1000 m f 1000 m f 100 nf + - r l 4 w r l 4 w + -
philips semiconductors TFA9843J 2-channel audio ampli?er (2 x se or 1 x btl) preliminary data rev. 02 19 january 2004 14 of 21 9397 750 12587 ? koninklijke philips electronics n.v. 2004. all rights reserved. remark: switching inductive loads, the output voltage can rise beyond the maximum supply voltage of 28 v. at high supply voltage it is recommended to use (schottky) diodes to the supply voltage and ground. 13.2 printed-circuit board 13.2.1 layout and grounding to obtain a high-level system performance, certain grounding techniques are essential. the input reference grounds have to be tied with their respective source grounds and must have separate tracks from the power ground tracks; this will prevent the large (output) signal currents from interfering with the small ac input signals. the small-signal ground tracks should be physically located as far as possible from the power ground tracks. supply and output tracks should be as wide as possible for delivering maximum output power. fig 20. btl application diagram. micro- controller mdb026 60 k w 60 k w 22 m f 470 nf 150 m f standby mute on short-circuit and temperature protection v ref 0.5v cc v cc v cc 9 4 in1 + in2 + out1 + out2 - svr civ mode 1 3 7 8 2 6 5 gnd TFA9843J v i v cc 1000 m f 100 nf r l 8 w + -
philips semiconductors TFA9843J 2-channel audio ampli?er (2 x se or 1 x btl) preliminary data rev. 02 19 january 2004 15 of 21 9397 750 12587 ? koninklijke philips electronics n.v. 2004. all rights reserved. 13.2.2 power supply decoupling proper supply bypassing is critical for low-noise performance and high supply voltage ripple rejection. the respective capacitor location should be as close as possible to the device and grounded to the power ground. proper power supply decoupling also prevents oscillations. for suppressing higher frequency transients (spikes) on the supply line a capacitor with low esr, typical 100 nf, has to be placed as close as possible to the device. for suppressing lower frequency noise and ripple signals, a large electrolytic capacitor, e.g. 1000 m f or greater, must be placed close to the device. the bypass capacitor on pin svr reduces the noise and ripple on the mid rail voltage. for good thd and noise performance a low esr capacitor is recommended. 13.3 thermal behavior and heatsink calculation the measured maximum thermal resistance of the ic package, r th(j-mb) , is 2.0 k/w. a calculation for the heatsink can be made, with the following parameters: t amb(max) =60 c (example) v cc = 18 v and r l =4 w (se) t j(max) = 150 c (speci?cation) r th(tot) is the total thermal resistance between the junction and the ambient including the heatsink. this can be calculated using the maximum temperature increase divided by the power dissipation: r th(tot) =(t j(max) - t amb(max) )/p d fig 21. printed-circuit board layout (single-sided); components view. audio power cs nijmegen 27 jan. 2003 / fp in2 + in1 + mute sb on tva TFA9843J - se2 + - se1 + +v p 1000 m f 1000 m f 1000 m f btl1/2 1 22 m f 10 k w 10 k w mce506 100 nf 150 m f 220 nf 220 nf mode sgnd svr svr civ civ
philips semiconductors TFA9843J 2-channel audio ampli?er (2 x se or 1 x btl) preliminary data rev. 02 19 january 2004 16 of 21 9397 750 12587 ? koninklijke philips electronics n.v. 2004. all rights reserved. at v cc =18vandr l =4 w (2 se) the measured worst-case sine-wave dissipation is 8.4 w; see figure 13 . for t j(max) = 150 c the temperature raise, caused by the power dissipation, is: 150 - 60=90 c: p r th(tot) =90 c r th(tot) = 90/8.4 = 10.7 k/w r th(h-a) =r th(tot) - r th(j-mb) = 10.7 - 2.0 = 8.7 k/w this calculation is for an application at worst-case (stereo) sine-wave output signals. in practice music signals will be applied, which decreases the maximum power dissipation to approximately half of the sine-wave power dissipation (see section 8.2.2 ). this allows for the use of a smaller heatsink: p r th(tot) =90 c r th(tot) = 90/4.2 = 21.4 k/w r th(h-a) =r th(tot) - r th(j-mb) = 21.4 - 2.0 = 19.4 k/w 14. test information 14.1 quality information the general quality speci?cation for integrated circuits, snw-fq-611 is applicable. 2 se loads; t amb =25 c; external heatsink of 10 k/w; music signals. btl loads; t amb =25 c; external heatsink of 10 k/w; music signals. fig 22. junction temperature versus supply voltage. fig 23. junction temperature versus supply voltage. 8 150 100 50 0 12 28 v cc (v) 16 20 24 mce504 t j (?c) r l = 2 w 4 w 6 w 8 w 16 w 8 150 100 50 0 12 28 v cc (v) 16 20 24 mce505 t j (?c) 2 w 3 w 4 w 8 w r l = 1 w
philips semiconductors TFA9843J 2-channel audio ampli?er (2 x se or 1 x btl) preliminary data rev. 02 19 january 2004 17 of 21 9397 750 12587 ? koninklijke philips electronics n.v. 2004. all rights reserved. 15. package outline fig 24. dbs9p package outline. references outline version european projection issue date iec jedec jeita dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. 2. plastic surface within circle area d 1 may protrude 0.04 mm maximum. sot523-1 0 10 mm 5 scale w m b p d h q 1 z 19 e e 1 m e 2 x a 2 non-concave d 1 d p k q 2 l 3 l 2 l qc e 00-07-03 03-03-12 dbs9p: plastic dil-bent-sil power package; 9 leads (lead length 12/11 mm); exposed die pad sot523-1 view b : mounting base side b unit b p l 1 cd (1) d h lq 2 mm 2.7 2.3 a 2 (2) 0.80 0.65 0.58 0.48 13.2 12.8 d 1 (2) 6.2 5.8 3.5 e h 3.5 e 2.54 e 1 1.27 e 2 5.08 4.85 q e (1) 14.7 14.3 z (1) 1.65 1.10 11.4 10.0 l 2 6.7 5.5 l 3 4.5 3.7 3.4 3.1 1.15 0.85 q 17.5 16.3 q 1 2.8 m 0.8 v 3.8 3.6 3 2 12.4 11.0 p k 0.02 x 0.3 w e h l 1 q v m
philips semiconductors TFA9843J 2-channel audio ampli?er (2 x se or 1 x btl) preliminary data rev. 02 19 january 2004 18 of 21 9397 750 12587 ? koninklijke philips electronics n.v. 2004. all rights reserved. 16. soldering 16.1 introduction to soldering through-hole mount packages this text gives a brief insight to wave, dip and manual soldering. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). wave soldering is the preferred method for mounting of through-hole mount ic packages on a printed-circuit board. 16.2 soldering by dipping or by solder wave driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the speci?ed maximum storage temperature (t stg(max) ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 16.3 manual soldering apply the soldering iron (24 v or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. 16.4 package related soldering information [1] for sdip packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. [2] for pmfp packages hot bar soldering or manual soldering is suitable. table 11: suitability of through-hole mount ic packages for dipping and wave soldering methods package soldering method dipping wave dbs, dip, hdip, rdbs, sdip, sil suitable suitable [1] pmfp [2] - not suitable
philips semiconductors TFA9843J 2-channel audio ampli?er (2 x se or 1 x btl) preliminary data rev. 02 19 january 2004 19 of 21 9397 750 12587 ? koninklijke philips electronics n.v. 2004. all rights reserved. 17. revision history table 12: revision history rev date cpcn description 02 20040119 - preliminary data (9397 750 12587) modi?cations: ? minor editorial changes. 01 20030915 - preliminary data (9397 750 10777)
9397 750 12587 philips semiconductors TFA9843J 2-channel audio ampli?er (2 x se or 1 x btl) ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data rev. 02 19 january 2004 20 of 21 contact information for additional information, please visit http://www.semiconductors.philips.com . for sales of?ce addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com . fax: +31 40 27 24825 18. data sheet status [1] please consult the most recently issued data sheet before initiating or completing a design. [2] the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the l atest information is available on the internet at url http://www.semiconductors.philips.com. [3] for data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 19. de?nitions short-form speci?cation the data in a short-form speci?cation is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values de?nition limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. 20. disclaimers life support these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes philips semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. when the product is in full production (status production), relevant changes will be communicated via a customer product/process change noti?cation (cpcn). philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise speci?ed. level data sheet status [1] product status [2][3] de?nition i objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. ii preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. iii product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. relevant changes will be communicated via a customer product/process change noti?cation (cpcn).
? koninklijke philips electronics n.v. 2004. printed in the netherlands all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. date of release: 19 january 2004 document order number: 9397 750 12587 contents philips semiconductors TFA9843J 2-channel audio ampli?er (2 x se or 1 x btl) 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 quick reference data . . . . . . . . . . . . . . . . . . . . . 2 5 ordering information . . . . . . . . . . . . . . . . . . . . . 2 6 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 7.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 functional description . . . . . . . . . . . . . . . . . . . 4 8.1 input con?guration . . . . . . . . . . . . . . . . . . . . . . 4 8.2 power ampli?er . . . . . . . . . . . . . . . . . . . . . . . . . 4 8.2.1 output power measurement . . . . . . . . . . . . . . . 5 8.2.2 headroom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8.3 mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 5 8.4 supply voltage ripple rejection . . . . . . . . . . . . . 6 8.5 built-in protection circuits . . . . . . . . . . . . . . . . . 6 9 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 thermal characteristics. . . . . . . . . . . . . . . . . . . 7 11 static characteristics. . . . . . . . . . . . . . . . . . . . . 7 12 dynamic characteristics . . . . . . . . . . . . . . . . . . 8 13 application information. . . . . . . . . . . . . . . . . . 13 13.1 application diagrams . . . . . . . . . . . . . . . . . . . 13 13.2 printed-circuit board . . . . . . . . . . . . . . . . . . . . 14 13.2.1 layout and grounding . . . . . . . . . . . . . . . . . . . 14 13.2.2 power supply decoupling . . . . . . . . . . . . . . . . 15 13.3 thermal behavior and heatsink calculation . . 15 14 test information . . . . . . . . . . . . . . . . . . . . . . . . 16 14.1 quality information . . . . . . . . . . . . . . . . . . . . . 16 15 package outline . . . . . . . . . . . . . . . . . . . . . . . . 17 16 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 16.1 introduction to soldering through-hole mount packages . . . . . . . . . . . . . . . . . . . . . . 18 16.2 soldering by dipping or by solder wave . . . . . 18 16.3 manual soldering . . . . . . . . . . . . . . . . . . . . . . 18 16.4 package related soldering information . . . . . . 18 17 revision history . . . . . . . . . . . . . . . . . . . . . . . . 19 18 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 20 19 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 20 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

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